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A.
开料
(
Cut Lamination)
a-1
裁板
( Sheets Cutting)
a-2
原物料发料
(Panel)(Shear material
to Size)
B.
钻孔
(Drilling)
b-1
内钻
(Inner
Layer Drilling )
b-2
一次孔
(Outer Layer Drilling )
b-3
二次孔
(2nd Drilling)
b-4
雷射钻孔
(Laser Drilling )(Laser
Ablation )
b-5
盲
(
埋
)
孔钻孔
(Blind & Buried Hole Drilling)
C.
干膜制程
( Photo Process(D/F))
c-1
前处理
(Pretreatment)
c-2
压膜
(Dry Film Lamination)
c-3
曝光
(Exposure)
c-4
显影
(Developing)
c-5
蚀铜
(Etching)
c-6
去膜
(Stripping)
c-7
初检
( Touch-up)
c-8
化学前处理
,
化学研磨
( Chemical Milling
)
c-9
选择性浸金压膜
(Selective Gold Dry
Film Lamination)
c-10
显影
(Developing )
c-11
去膜
(Stripping
)
Developing , Etching &
Stripping ( DES )
D.
压合
Lamination
d-1
黑化
(Black
Oxide Treatment)
d-2
微蚀
(Microetching)
d-3
铆钉组合
(eyelet )
d-4
叠板
(Lay up)
d-5
压合
(Lamination)
d-6
后处理
(Post
Treatment)
d-7
黑氧化
( Black Oxide Removal )
d-8
铣靶
(spot face)
d-9
去溢胶
(resin
flush removal)
E.
减铜
(Copper Reduction)
e-1
薄化铜
(Copper Reduction)
F.
电镀
(Horizontal Electrolytic
Plating)
f-1
水平电镀
(Horizontal Electro-
Plating) (Panel Plating)
f-2
锡铅电镀
( Tin-
Lead Plating ) (Pattern Plating)
f-3
低于
1 mil (
Less than 1 mil Thickness )
f-4
高于
1 mil (
More than 1 mil Thickness)
f-5
砂带研磨
(Belt
Sanding)
f-6
剥锡铅
( Tin-Lead Stripping)
f-7
微切片
( Microsection)
G.
塞孔
(Plug Hole)
g-1
印刷
( Ink Print )
g-2
预烤
(Precure)
g-3
表面刷磨
(Scrub)
g-4
后烘烤
(Postcure)
H.
防焊
(
绿漆
/
绿油
): (Solder Mask)
h-1
C
面印刷
(Printing Top Side)
h-2
S
面印刷
(Printing Bottom Side)
h-3
静电喷涂
(Spray Coating)
h-4
前处理
(Pretreatment)
h-5
预烤
(Precure)
h-6
曝光
(Exposure)
h-7
显影
(Develop)
h-8
后烘烤
(Postcure)
h-9
UV
烘烤
(UV Cure)
h-10
文字印刷
(
Printing of Legend )
h-11
喷砂
( Pumice)(Wet Blasting)
h-12
印可剥离防焊
(Peelable Solder Mask)
I .
镀金
Gold plating
i-1
金手指镀镍金
( Gold
Finger )
i-2
电镀软金
(Soft Ni/Au Plating)
i-3
浸镍金
( Immersion Ni/Au)
(Electroless Ni/Au)
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